发明名称 Multilayered heat-insulating panel, in particular for floors
摘要 The multilayered heat-insulating panel is composed of a pressure-resistant top panel (1) e.g. wood chip, and of a rigid-foam panel (3) adhesively bonded on the underside thereof. The wood-chip panel (1) has a tongue (2) on one side and a corresponding groove on the opposite side, while the rigid-foam panel (3) has stud teeth (4) on the corresponding sides. This results in a toothed connection of the rigid-foam panels (3) at the butt joints when the panels are fitted together. In the longitudinal direction of the tongue-and-groove, curved milled recesses (5) are provided in the rigid-foam panel (3), on the adhesively bonded side thereof. Said milled recesses (5) cut into the rigid-foam panel (3) overlap mutually. The rigid-foam region (9) between the incisions (8, 10) of two neighbouring milled recesses (5) thus have an approximately resilient effect. Soundwaves impinging perpendicularly on the wood-chip panel (1) are interrupted throughout on an air layer produced by the milled recesses (5). The heat-insulating panel is particularly suitable for floors. <IMAGE>
申请公布号 CH644422(A5) 申请公布日期 1984.07.31
申请号 CH19790007748 申请日期 1979.08.27
申请人 LINZMEIER, FRANZ JOSEF 发明人 FRANZ JOSEF LINZMEIER
分类号 E04F15/02;E04F15/022;E04F15/18 主分类号 E04F15/02
代理机构 代理人
主权项
地址