发明名称 |
Method of forming energy beam activated conductive regions between circuit elements |
摘要 |
A method of manufacturing semiconductor devices is disclosed. In the method, a redundancy circuit is formed by forming circuit elements making up an integrated circuit on a semiconductor substrate and a spare element connected to the circuit element through an electrically non-active region. Then, an impurity region is formed in the non-active region by introducing impurity and is electrically selectively activated with laser irradiation, whereby the circuit elements and the spare element are interconnected electrically.
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申请公布号 |
US4462150(A) |
申请公布日期 |
1984.07.31 |
申请号 |
US19820419067 |
申请日期 |
1982.09.16 |
申请人 |
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA |
发明人 |
NISHIMURA, HIDETARO;NOZAWA, HIROSHI |
分类号 |
H01L21/822;H01L21/265;H01L21/268;H01L21/3205;H01L21/768;H01L21/82;H01L23/52;H01L27/04;(IPC1-7):H01L21/26;H01L21/26 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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