发明名称 Method of forming energy beam activated conductive regions between circuit elements
摘要 A method of manufacturing semiconductor devices is disclosed. In the method, a redundancy circuit is formed by forming circuit elements making up an integrated circuit on a semiconductor substrate and a spare element connected to the circuit element through an electrically non-active region. Then, an impurity region is formed in the non-active region by introducing impurity and is electrically selectively activated with laser irradiation, whereby the circuit elements and the spare element are interconnected electrically.
申请公布号 US4462150(A) 申请公布日期 1984.07.31
申请号 US19820419067 申请日期 1982.09.16
申请人 TOKYO SHIBAURA DENKI KABUSHIKI KAISHA 发明人 NISHIMURA, HIDETARO;NOZAWA, HIROSHI
分类号 H01L21/822;H01L21/265;H01L21/268;H01L21/3205;H01L21/768;H01L21/82;H01L23/52;H01L27/04;(IPC1-7):H01L21/26;H01L21/26 主分类号 H01L21/822
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