Interconnection support for welding (soldering) leads to the electrodes of a semiconductor device

摘要

The interconnection support comprises at least one insulating support (1) provided with apertures (2) and a conducting structure solid with the said support. This structure defines networks (4, 5) of conductive elements (6) extending radially beyond the apertures (2) of the insulating support (1) and including protuberances arranged in a pattern identical to that of the electrodes of the semiconductor device. These protuberances are formed by the bent inside ends (7) of each conducting element.