发明名称 LEAD FRAME FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To enable to perform surely and moreover easily positioning of the pellet mounting part or the pellet part of a lead frame by a method wherein recess and protrusion parts for positioning are provided to the tie bar parts of the lead frame. CONSTITUTION:Recess and protrusion parts 14 for positioning are provided to the tie bar parts 11 of a lead frame. Accordingly, by putting the recess and protrusion parts 14 thereof together with protrusions for positioning on an assembling mechanism side, slippage in the lateral direction being not restricted usually is removed, and correct positioning can be attained. For example, the positioning conical parts of a sealing jig 34 are engaged correctly with the V-shape parts of the tie bar parts of a lead frame 35 equipped to the sealing jig similarly as usual method, and deviation in the lateral direction of a pellet 38 is restricted satisfactorily together with a positioning pin 32.
申请公布号 JPS59132640(A) 申请公布日期 1984.07.30
申请号 JP19830007868 申请日期 1983.01.20
申请人 NIPPON DENKI KK 发明人 TOKISAKI YOSHINAGA
分类号 H01L23/48;H01L23/495;H01L33/62 主分类号 H01L23/48
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