发明名称 METHOD AND APPARATUS FOR FORMING RESIST PATTERN
摘要 PURPOSE:To reduce the variance of size extending over the whole on a substrate to be treated, and to improve the accuracy of a pattern by cooling a resist film by lowering the temperature of the film while bringing the whole film to a uniform temperature. CONSTITUTION:A substrate 1 to which a pre-baking is completed is shifted to a belt conveyor 9, and carried and introduced to a cooling mechanism 10. The substrate 1 is transferred to a carrier mechanism 11 movable vertically and left and right, dipped in pure water 13 in a cooling tank 12, and cooled uniformly. The cooled substrate 1 is shifted on a belt conveyor 14 by the carrier mechanism 11, and placed on a rotary sample base 15 for spin drying. The substrate 1 dried by the revolution of the sample base 15 is transferred on a belt conveyor 17 by a vacuum chuck 16, and carried out.
申请公布号 JPS59132127(A) 申请公布日期 1984.07.30
申请号 JP19830005876 申请日期 1983.01.19
申请人 TOSHIBA KK 发明人 KATOU YOSHIHIDE;USUDA KINYA;KIRITA KEI;SHINOZAKI TOSHIAKI;TSUCHIYA NOBUJI;SHIGEMITSU FUMIAKI
分类号 H01L21/027;G03F7/38;H01L21/30 主分类号 H01L21/027
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