| 摘要 |
PURPOSE:To permit development to be uniformly effected within a wafer with a reduced amount of a developer within a short period of time and with excellent reproducibility, by providing a disk-shaped plate having a bore capable of supplying, for example, a developer, such that the plate opposes against a rotatable chuck which horizontally suction-holds a semiconductor wafer. CONSTITUTION:A wafer 3 is suction-held by a rotatable chuck 4 such that the respective opposing surfaces of the wafer 3 and a developer supply part 10 are 0.2-2mm. apart in parallel to each other. A developer 2 is supplied from a developer supply bore 11 provided in the developer supply part 10 such as to completely fill up the space defined between the wafer 3 and the developer supply part 10. Thereafter, the wafer 3 is rotated at a speed between 10rpm and 200rpm, or the developer 2 is supplied while the wafer 3 is being rotated. If the wafer 3 is rotated at low speed during development, then it is possible to reduce the amount of the developer used to about 10CC per wafer. Further, since the wafer is rotated during development, the developer is stirred, so that the time required for development is reduced, and the development is uniformly effected within the wafer. |
