| 摘要 |
PURPOSE:To prevent a semiconductor device from building up of a humidity invading path in a resin molded part by a method wherein a lead frame is formed in a type bent to have a zigzag type in a plane, and the mounting lands of a chip are supported by irregularly bent hang pins whose surface and back are formed as uneven faces. CONSTITUTION:At a lead frame, hang pins 8 are constructed in a shape bent to have a zigzag type or a crank type in a plane, and the surface and the back of the hang pin 8 are constructed as uneven faces having recess parts 9, 9a at places. When a resin sealed semiconductor device is manufactured using the lead frame having the hang pins 8 like this, because the hang pins 8 are bent to have a zigzag type in a plane, and moreover, because the surface and the back of the hang pin 8 are also constructed as uneven faces, bonding intensity of the resin and the hang pins in the resin molded part is large, accordingly even when relative displacement of both is generated, bonding of the resin and the hang pins is hardly put out of joint, and fear to generate a humidity invading path in a resin molded part is reduced extremely as compared with the usual semiconductor device. |
