| 摘要 |
<p>PURPOSE:To prevent an exfoliation in a semiconductor pellet by mounting the pellet on a substrate by using a eutectic alloy consisting of aluminum, gold and silicon. CONSTITUTION:An aluminum layer 4 is applied and formed on a ceramic substrate 1 through evaporation, etc., and an aluminum layer 5 and a gold layer 6 are formed on the back of a semiconductor pellet 2 through evaporation, etc. A gold foil 7 is interposed between the aluminum layer 4 and the gold layer 6 and the whole is heated in a short time at approximately 420 deg.C on a pellet mount. Consequently, the aluminum layers 4, 5, the gold layer 6 and the gold foil 7 are melted, and made eutectic with the silicon of the pellet 2, thus forming an Al- Au-Si eutectic alloy 3. An oxidation in silicon in the eutectic alloy 3 can be prevented, and an exfoliation in the pellet 2 and a cracking to the pellet can be obviated.</p> |
