| 摘要 |
PURPOSE:To improve reliability, by forming a commonly fusing ring part only by dipping a cover in a fused metal. CONSTITUTION:Plating 2 is applied on the required part of a blanked cover 1 of Kovar and the like. Solder is dipped in the next process, so that the solder is not attached to a part other than the plated part. Then, preprocessing is performed so that eutectic alloy is not attached to a part other than a part where fusing and connection are required at the time of dipping. The cover 1 is dipped in an electric furnace 3 wherein the eutectic alloy is fused. Thereafter, the cover 1 is kept in a horizontal attitude and lifted, and only a eutectic alloy layer 4 is formed at a required thickness. Then, attachment preventing agent is removed by etching processing and the like. |
