发明名称 SOLDER TANK
摘要 PURPOSE:To improve additionally soldering performance by providing two jet ports in the upper part of a solder tank to generate jet waves and further forming rugged waves in the jet waves. CONSTITUTION:The solder melt 5 in a solder tank 4 is pressurized as an impeller 12 rotates. The pressurized solder melt flows through a flow pipe 11 and enters a jet tank 6, where the solder asends in jet ports 7, 8 and arrives at jet bodies 13, 14. The solder is ejected from respective through-holes 17, 18 in an arrow D direction and forms jet waves 5a, 5b; it also forms many rugged waves 5c, 5d. More specifically, the solder melt 5 gushes out at the through-holes 17, 18 of the jet bodies 13, 14 and flows circumferentially and therefore the height of the melt 5 increases and many rugged waves 5c, 5d are formed on the peaks of the waves 5a, 5b in the direction intersecting with the traveling direction of a printed circuit board 1.
申请公布号 JPS59130675(A) 申请公布日期 1984.07.27
申请号 JP19830005282 申请日期 1983.01.18
申请人 KONDOU KENJI 发明人 KONDOU KENJI
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
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