| 摘要 |
<p>PURPOSE:To effectively prevent the generation of spark and contrive to improve the reliability by a method wherein the outer peripheral part of the mounting surface of a frame bed whereon each of semiconductor pellets on the light emitting and light receiving sides is mounted is formed into an arc form surface. CONSTITUTION:The outer peripheries of the surfaces of the frame beds 20a and 20b whereon the semiconductor pellets 11a and 11b are mounted are formed into cross-sectional arc form surfaces 21a-21b by eliminating acute angular parts in the form of e.g. press type at the time of punch-press work. In such a case that a high voltage of several kV for example is impressed between the input and the output, i.e., the light emitting side and the light receiving side, a high voltage is set between exposed parts 19a and 19b and the arc form surfaces 21b and 21c via clearances 17a and 17b remaining at the resin part. On the other hand, in this case, charges going to be emitted from the outer peripheries of the frame beds 20a and 20b come to disperse, corresponding to the arc form surfaces 21b and 21c, without concentrating to a certain point, since the outer peripheries become the arc form surfaces 21b and 21c.</p> |
