| 摘要 |
PURPOSE:To obtain a device for sealing circuit elements having a good sealing degree by a method wherein a conductor is formed in a ring form in the periphery of the upper surface of a substrate provided with the circuit elements, the upper surface of this insulator is covered with a cap body, a conductive layer is formed on the inner surface of the groove at the part wherein this cap body abuts against the conductor, and this conductive layer is joined to the conductor with solder. CONSTITUTION:An Si substrate 2 is installed on a heat sink 1 with an Si adhesive, the patterns 3 of silver palladium and the circuit elements 4 such as transistors are formed on this substrate 2. Besides, the conductor 5 is formed in a ring form in the periphery of the upper surface of the substrate 2, which conductor 5 is provided at a time by means of silver palladium at the time of forming the patterns 3. On the other hand, the cap body 6 covering the upper surface of the substrate 2 is formed of an ABS resin or a Noryl series resin. The groove 7 is formed in a ring form at the part wherein this cap body 6 abuts against the conductor 5, and thereafter a conductive layer 8 is formed by plating the inner wall of the cap body 6 with the alloy of Sn and Ni series. Then, the groove 7 is filled with low melting point solder 9 and heat-treated, and then the conductive layer 8 and the conductor 5 are adhered with the solder 9, resulting in a sealed structure. |
