发明名称 VERFAHREN UND VORRICHTUNG ZUM VERBINDEN VON LEITERPLATTEN
摘要 A method for connecting two circuit boards characterized in that by using rubber connectors, each having an open part for receiving circuit boards, an edge of a first circuit board requiring connection inserted into the open part of the rubber connector, followed by pressing a second rubber connector against the circuit board to complete connection of the two circuit boards.
申请公布号 DE3401956(A1) 申请公布日期 1984.07.26
申请号 DE19843401956 申请日期 1984.01.20
申请人 SHARP K.K. 发明人 TANIGUCHI,KOKI;YAMAGUCHI,SHIGERU;NAKAYAMA,KEIJI
分类号 H01R11/01;G02F1/1345;H01R11/03;H01R43/00;H05K1/18;H05K3/32;H05K3/36 主分类号 H01R11/01
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