| 发明名称 |
SUBSTRATE AND INTEGRATED CIRCUIT MODULE WITH THIS SUBSTRATE |
| 摘要 |
A multi-layer metallized substrate comprises a matrix of sintered silicon particles joined by a thin insulating layer of silicon dioxide or silicon nitride. Semiconductor circuit chips are bonded to the surface of the substrate to form an electrically connected, unitary integrated circuit module structure. |
| 申请公布号 |
EP0038931(A3) |
申请公布日期 |
1984.07.25 |
| 申请号 |
EP19810102043 |
申请日期 |
1981.03.19 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDMONDS, HAROLD DONALD;MARKOVITS, GARY |
| 分类号 |
H05K3/46;H01B3/12;H01L23/15;H01L23/538;H05K1/03;(IPC1-7):H01L23/14;H01L23/54 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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