Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip.

摘要

Disclosed is a method of forming a thick film circuit pattern according which involves moving a nozzle having a slit opening above the surface of a stationary substrate with the elongation of the slit opening being oriented at an angle to the direction of movement of the nozzle and forcing a paste in the nozzle downward through the slit opening onto the substrate to deposit a sufficiently wide and uniformly thick film strip. Preferably, the surface irregularities of the substrate are detected without contacting it for controlling the position of the slit opening above the substrate so that it follows closely parallel with the surface contour line of the substrate.