| 摘要 |
PURPOSE:To contrive improvement in production efficiency without giving effect on a chip and a wire connection by a method wherein a semiconductor chip is stored in the package main body of thermoplastic resin, heated up to the resin- fusing temperature or below and the above is supersonic-welded with the cover. CONSTITUTION:A junction part 3 is provided on an apertre face 1a of the package main body of thermoplastic resin, a semiconductor chip 2 is installed, a preheating is performed after a cover 6 of the same material as the main body 1 is placed thereon, and the above is maintained at the resin fusing temperature or below. After the above has been softened, the cover 6 and the junction part 3 are welded by pressing a supersonic horn, and a device 11 is completed. According to this constitution, as the main body 1 is softened by heating, the oscillation energy of the horn 8 is absorbed, the damage which will be given to the chip 2 and the wire 5 can be prevented, a highly reliable device can be obtained, and a welding work can be performed instantaneously, thereby enabling to increase the production efficiency remarkably. |
