Method and apparatus for embedding wire in a photocurable adhesive.

摘要

The method and apparatus for embedding wire (14) in a photocurable adhesive is particularly useful in the fabrication of an encapsulated wire circuit board. Wire is laid in a softened layer (12) of photocurable adhesive and simultaneously the photocurable adhesive is cured. The curing process may be carried out in either one or two steps. The apparatus used in the one step process and in the first step of the two step process includes an adhesive heating means (16) as well as an adhesive optical curing means (17). The second step of the two step process uses an optical curing oven (35). By simultaneously curing the adhesive as the wire (14) is laid, the position integrity of the wire pattern is maintained.