RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To obtain a resin sealer having high reliability by enclosing a pellet covered with thermosetting resin further with predetermined thermosetting resin. CONSTITUTION:A semiconductor pellet 2 and a soldered portion 5 are covered with thermosetting resin 8, and further enclosed with thermosetting resin 3. The resin 3 does not contain mold releasing material such as wax, and necessarily has 5kg/cm<2> of bending strength after thermosetting and 2.5X10<-6>/ deg.C of thermal expansion coefficient. A groove 9 is formed to surround the pellet 2 on a substrate 1 to prevent the resin 8 from sliding on the substrate 1, four or more through holes 10 are formed around the pellet to reduce a stress due to contraction after resin molding. With this configuration, a resin-sealed device having high reliability is obtained.