| 摘要 |
PURPOSE:To contrive to form the titled device in a small type and to enhance efficiency thereof by a method wherein a stack is immersed in a condensable coolant in a first airtight chamber, and in a second airtight chamber surrounding the outside circumference thereof, an endlessly cooling system is constructed of airtight vessels of the plural number filled with a liquid coolant, a cooler, a pump, and connected and collected outlets and inlets. CONSTITUTION:Generated heat of semiconductor elements 4a is transmitted to the inside wall of a first airtight chamber A according to a first coolant 51 through cooling pieces 4b, and is transmitted to a second coolant 52 in a second airtight chamber B through cooling pieces 311a. Heat thereof is forcibly circulated according to a pump 16 in an endlessly cooling system 70, and is cooled according to a cooling air 12, a running air 13 in a cooler 20. The cooled second coolant 52 returns to an airtight vessel 301, and cools the first coolant 51 through the cooling pieces 311a to contribute to cooling of the semiconductor elements 4b. By constructing the device in such a way, because the heat transmitting area from the first coolant 51 to the second coolant 52 can be reduced, the airtight vessel 301 also can be formed in a small type, utilization efficiency is improved, and moreover, the device can be formed in a small type and in light weight. |
