HOT DIPPING METHOD OF TWISTED WIRE

摘要

PURPOSE:To form a hot dipping layer having no pinhole, etc. in the stage of hot dipping a copper twisted wire with tin or solder by oscillating the twisted wire in the part of a hot dipping bath just before it enters the hot dipping bath. CONSTITUTION:Plural pieces of copper wires are twisted as they are or after prior tin plating or solder plating. A twisted wire 4 thereof is immersed in a hot dipping bath 3 of tin or solder to hot dip the tin or solder on the surface of the wire 4. The wire 4 is passed in a die 5 in this case; at the same time, the die 5 is oscillated by the rotation of a motor 6 with the aid of a cam 7 and a spring 8 to oscillate the wire 4 at >=50Hz in the part thereof in the bath 3 just before the wire enters the bath 3. The hot dipping layer of tin or solder having no pinhole and undeposited part is formed on the surface of the wire 4.