| 摘要 |
PURPOSE:To enable to mount a superhighly integrated IC chip having many input/output terminals and large quantity of heat generation in a microminiature size by forming a structure that an IC chip body is bonded to a cover side having preferable thermal conductivity. CONSTITUTION:An IC chip 8 in which all leads 12 are connected in advance onto a ceramic substrate 7 is placed in a face down manner, and the leads 12 and bonding pads 13 are simultaneously bonded. Connecting wirings 19 of the front suface of the substrate 7 are connected to the bonding pad 13, and connected to terminal pads 11 formed on the back surface of the substrate 7 through via-hole wirings 17. A cover 9 is coated on the mounting surface of the chip 8 on the substrate 7, and the chip 8 is bonded via an adhesive 15. An adhesive 16 employs a resin adhesive such as silver filler conductive epoxy adhesive having good thermal conductivity. |
