发明名称 AUTOMATIC PLATING DEVICE
摘要 PURPOSE:To ensure high operation efficiency by providing multiple plating tanks between a pre-process tank and an after-process tank and providing a selective transport mechanism of objects to be plated to the plating tanks so that the objects to be plated can be continuously plated one by one. CONSTITUTION:Multiple plating tanks 1 with energizing electrodes respectively are arranged between a pre-process tank 3 and an after-process tank 3', in addition, a selective transport mechanism 6 of objects 7 to be plated to the tanks 1 selectively transporting the objects 7 to be plated transported from the tank 3 in sequence to the tanks 1 and tansporting the plated objects 7 to the tank 3' is provided. This selective transport mechanism 6 is provided with a frame 12 elevatably installed on a stanchion 9 and a transport chain mechanism 11 for the objects 7 to be plated installed on the frame 12. As a result, the objects 7 to be plated such as flexible circuit substrate, etc. can be continuously plated one by one, and the plating process can be applied with high operation efficiency while the whole device is made small-sized.
申请公布号 JPS59124620(A) 申请公布日期 1984.07.18
申请号 JP19820232895 申请日期 1982.12.30
申请人 NIPPON MEKTRON KK 发明人 YOSHIDA MASAHIRO
分类号 B65G21/12;B65G49/04;C25D17/06;C25D19/00;H05K3/24 主分类号 B65G21/12
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