| 摘要 |
PURPOSE:To form accurately a thermally stable high resistor on a printed circuit board by adding an Re salt to an Ni salt or a Co salt used in a chemical resistance plating method. CONSTITUTION:A resistor film is directly formed on an insulating board by chemical plating using a soln. contg. an Ni salt and/or a Co salt, an Re salt, a complexing agent, a reducing agent and a pH adjusting agent. For example, the plating is carried out at 83-87 deg.C for 10min using a plating soln. prepd. by adding an aqueous ammonia soln. to 0.1mol/l CoCl2, 0.0075mol/l KReO4, 0.5mol/ lsodium citrate and 0.5mol/l sodium hypophosphite so as to adjust the pH to 11.0. The resulting film has 20.07kOMEGA/? surface resistance value. |
