| 摘要 |
PURPOSE:To simplify the conveyance system for tests and markings without needing the supply in alignment according to the parts feeder as well as to prevent the deterioration of the plating parts on external leads by a method wherein a long frame is used. CONSTITUTION:Tie bar parts 6 are separated by cutting in the tie bar cutting process after the processes of foil-coating and die-bonding, wire-bonding, molding and solder dipping. A long frame is severed in the standard length, two out of three external leads are separated by cutting from a frame 7, and each of the severed frames is set as a semiconductor device series. Regarding the length to cut the long frame in the specified length, the degree that fifty pieces of semiconductor elements are included each strip is the optimum. In the test-marking process, elements are supplied to the tester in the unit of the semiconductor device strips and the positioning for the measuring is carried out using guide holes 81. The positions on the water are kept in the unit of the semiconductor device strip and each element can be dealt with relating with other elements, resulting in enabling to prevent the deteriorating of plating on the armored leads without using the parts feeder. |
