| 摘要 |
<p>PURPOSE:To pick up chips without damaging them by cutting a wafer, on the back thereof a solder layer is formed, at every chip without cutting the solder layer, heating the back on the separation of the chips to melt the solder layer and picking them up from an upper section. CONSTITUTION:The movement of the wafer 10 is interrupted when a specific chip 11 reaches on a heater 15, and the heater 15 is conducted during the time when the wafer 10 is placed in a hot plate 13, and connected to a temperature sensor so as to apply a fixed temperature to the chip reaching on it. When solder melts and softens, an attachment 16 is dropped up to a section just above the chip, sucks the chip under vacuum and is lifted, is moved to a package assembly section, and is dropped and places the chip at a predetermined position in a package, thus bonding and fixing the chip in the package. Accordingly, since cut and several chip is separated from the wafer, on the back thereof the solder layer is formed, the chips are not damaged, and handling work is automated, thus improving reliability in an assembly to the package of the chips and yield on manufacture.</p> |
