发明名称 HEAT-RESISTING ADHESIVE SHEET
摘要 PURPOSE:To obtain an excellent alpha-ray shielding film by forming a heat-resisting adhesive layer on a heat-resisting organic film base material and forming a composite body, the total of thickness thereof reaches a specific value or more. CONSTITUTION:The heat-resisting adhesive layer is formed on the heat-resisting organic film base material, and the composite body, the total of thickness thereof reaches 30mum or more, is formed. Each material of a polyimide group, a fluorine group, a silicon group, a polysulfone group, a polyether sulfone group, a polyester group, a polyamide imide group, a polyamide group, etc. is used as the film base material and each material of a silicon group, a fluorine group, a polyamide group, an epoxy group, a polyimide group, a polyamide imide group, a phenol group, etc. as heat-resisting adhesives. alpha-Rays can be shielded only to a necessary section in the adhesive sheet of such constitution, and the sheet can be pasted even in any process.
申请公布号 JPS59121956(A) 申请公布日期 1984.07.14
申请号 JP19820228305 申请日期 1982.12.28
申请人 TOMOEGAWA SEISHIJIYO:KK 发明人 KOSHIMURA ATSUSHI;TSUSHIMA MASAMOTO;TSUKADA HITOSHI
分类号 H01L23/02;H01L23/556 主分类号 H01L23/02
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