| 摘要 |
PURPOSE:To enable to improve the mounting density, to deform by external impact, to electrically shortcircuit between adjacent mounting electronic parts and to prevent the shortcircuit between external leads by exposing the external leads only at the bottom of a resin-seal, thereby reducing the width of an IC package. CONSTITUTION:External leads 14 are not presented on the side face of an IC package 16, exposed only at the bottom of a resin-seal 15, and the side face 16 becomes tapered by considering the removal of the mold. In this manner, the width (w) of the IC package is reduced in the amount corresponding to the thickness (t) of the external leads 14. Further, the leads 14 are buried in the seal 15, and the resin is introduced between the leads 14 to be protected. |
