| 摘要 |
PURPOSE:To contrive an improvement in reliability and productivity of a semiconductor device by preventing powder of wafer from being transferred to a processing chamber, by preventing an edge part of the wafer from damaging by providing a plurality of gas blow-off openings on wall surfaces of the inside of side walls of a transferring path. CONSTITUTION:Gas blow-off openings 16 are provided on the sides of a transferring path side of side walls 15 on both sides of an air bearing 11 and gas is made to blow off against the sides of a body 12 to be transferred, through which the body 12 to be transferred is prevented from bringing into contact with the side walls 15. It means that when the body 12 to be transferred approaches the right side wall 15, it is pushed away to the other side by the gas from the right blow-off opening 16 and then when the body 12 approaches the left side wall 15, the body 12 is pushed away to the other side contrary to the above. Although the body 12 to be transferred, therefore, repeats zigzag motion, it does not happen that the body 12 hits against the side wall 15. Lifting and transferring of the body 12 to be transferred are performed by the blow-off gas from a blow-off opening 13 provided on a floor surface 14 as usual. Wafer, therefore, can be transferred without damaging the same and reliability and productivity of the device can be improved in a production process of a semiconductor device. |
