发明名称 METHOD AND APPARATUS FOR INSPECTING COPPER FOIL PATTERN OF PRINTED-WIRING BOARD
摘要 PURPOSE:To make it possible to perform the certain and stable inspection of a printed- wiring board, by comparing the adhesion area of the copper foil pattern on the printed- wiring board to be inspected with the area of the same opposed surface of a reference printed-wiring board. CONSTITUTION:A reference printed-wiring board 11a and a printed-wiring board 11b to be inspected are respectively placed on a mount table while scanning heads 4 are respectively positioned above both boards 11a, 11b and lights are projected to the minute sections on the entirely same surfaces of both boards 11a, 11b from projection parts 1. Reflected lights are received by a first light receiving part 3 and a second light receiving part 2 and inputted to operators 6 while converted to electric signals by photoelectric converters 5. The difference of light amounts from the first and the second light receiving parts are calculated by these operators 6 and the information thereof is inputted to a comparator 7. As the result of comparison, if both light amounts are the same, the printed-wiring board to be inspected is judged as success in an inspection and, if different, it is judged as failure. By this method, the inspection can be performed by an automation method due to a machine and certain and stable inspection can be performed.
申请公布号 JPS59120850(A) 申请公布日期 1984.07.12
申请号 JP19820229999 申请日期 1982.12.27
申请人 SHIRAI DENSHI KOGYO KK 发明人 MUGISHIMA AKIO
分类号 H05K3/00;G01N21/88;G01N21/93;G01N21/956 主分类号 H05K3/00
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