| 摘要 |
PURPOSE:To avoid dipping to fused solder and thus prevent warp or deformation by providing a solder electrode layer on an Si wafer by a chemical reaction wherein an organic tin compound and noble metallic ions are utilized. CONSTITUTION:For example, caprylic acid stannous isopropyl alcoholic solution is applied on a clean Si wafer and then dried, thus forming a thin film. When it is dipped in the HCl solution of PdCl2, a part of the stannous caprylate hydrolyzes, and a Pd particle layer is deposited and absorbed on the thin film by the reducing property of the produced stannous tin. Next, it is pressed by means of a plate at approx. 150 deg.C at 500g/cm<2>, thus being changed into an amorphous Sn oxide thin film containing Pd and backed on the wafer. Then, a solder electrode film is adhered on the Pd layer to a required shape by dipping in a solder plating bath. This constitution enables to form a uniform and stable solder electrode without generating warp or deformation on the wafer. |
