| 摘要 |
PURPOSE:To prevent the damage of a semiconductor chip by pasting a tape on the chip, sucking the surface of the tape and transferring and fitting the chip. CONSTITUTION:The tape 14 in which acryl group adhesives are applied on a film such as a polyimide film is pasted on the surface of the square semiconductor chip 11. When the surface of the tape is sucked by a collet 12, the tape 14 functions as a buffer material, and the damage of the chip can be prevented. It is advantageous that the size of the tape corresponds to approximately 30-80% of the area of the chip. According to the constitution, the collet needs not be exchanged in response to the chip, and the damage of the chip is prevented. |
