发明名称 |
SOLDERING METHOD BETWEEN WAVEGUIDE AND FLANGE |
摘要 |
PURPOSE:To avoid generation of pinholes by champering the peripheral part of a hole at the coupled surface side of a flange. CONSTITUTION:A rectangular hole 11 for insertion of a waveguide 2 made of an aluminum material is formed to a flange 1 also made of an aluminum material. Then the peripheral part 13 of the hole 11 is champered over the entire circumference at the side of a coupled surface 12. The champer size (c) is set larger than the cut processing size (t). The waveguide 2 is put into the hole 11 of the flange 1 so that the tip of the waveguide 2 protrudes slightly over the surface 12. Under such conditions, both the flange 1 and the waveguide 2 are heated and the flux is coated to a champered surface 13. Then a solder material is welded to the part 13 for soldering, and the surface 12 is cut flat after the soldering. |
申请公布号 |
JPS59119904(A) |
申请公布日期 |
1984.07.11 |
申请号 |
JP19820226624 |
申请日期 |
1982.12.27 |
申请人 |
FUJITSU KK |
发明人 |
TETSU SADAYUKI;ABE KOUICHI;NAKAUCHI SUSUMU;TAWARA MAMORU;KOTAKA SATOSHI |
分类号 |
H01P11/00;(IPC1-7):01P11/00 |
主分类号 |
H01P11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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