发明名称 SOLDERING METHOD BETWEEN WAVEGUIDE AND FLANGE
摘要 PURPOSE:To avoid generation of pinholes by champering the peripheral part of a hole at the coupled surface side of a flange. CONSTITUTION:A rectangular hole 11 for insertion of a waveguide 2 made of an aluminum material is formed to a flange 1 also made of an aluminum material. Then the peripheral part 13 of the hole 11 is champered over the entire circumference at the side of a coupled surface 12. The champer size (c) is set larger than the cut processing size (t). The waveguide 2 is put into the hole 11 of the flange 1 so that the tip of the waveguide 2 protrudes slightly over the surface 12. Under such conditions, both the flange 1 and the waveguide 2 are heated and the flux is coated to a champered surface 13. Then a solder material is welded to the part 13 for soldering, and the surface 12 is cut flat after the soldering.
申请公布号 JPS59119904(A) 申请公布日期 1984.07.11
申请号 JP19820226624 申请日期 1982.12.27
申请人 FUJITSU KK 发明人 TETSU SADAYUKI;ABE KOUICHI;NAKAUCHI SUSUMU;TAWARA MAMORU;KOTAKA SATOSHI
分类号 H01P11/00;(IPC1-7):01P11/00 主分类号 H01P11/00
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