发明名称 |
PRINTED CIRCUIT BOARD WITH SOLDER FLOW PATH |
摘要 |
<p>A printed circuit board substrate is mounted with electric circuit components to form an electric circuit thereon. The printed circuit board is provided with a land without a piercing hole for electrical connection with an electrode of a chip-shaped leadless element, and a land with an aperture for the insertion of the lead wire of a component or element with a lead, and further a pilot pattern for leading melted solder in spite of the presence of evaporated solder flux gas or air during a solder dipping operation. The pilot pattern may comprise a conductive pattern connecting the land for the leadless element and the land for the element with lead. At least elimination of the solder resist layer on a portion of the conductive pattern to form the pilot pattern.</p> |
申请公布号 |
CA1170782(A) |
申请公布日期 |
1984.07.10 |
申请号 |
CA19810381279 |
申请日期 |
1981.07.07 |
申请人 |
SONY CORPORATION |
发明人 |
TAKAHASHI, TOSHIO;OHSAWA, MITSUO |
分类号 |
H05K1/02;H05K3/30;H05K3/34;H05K3/38;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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