发明名称 FORMATION OF LOW MELTING POINT ALLOY LAYER FOR DIFFUSION JOINING
摘要 PURPOSE:To form uniformly a low melting point alloy layer for diffusion joining on joint surface by providing a film for preventing the formation of the low melting point alloy layer on the surface of a material to be joined except its joint surface then forming the low melting point alloy layer on the joint surface and removing the above-mentioned preventing film by an etching treatment. CONSTITUTION:A film 3 for preventing the formation of a low melting point alloy is formed on the part of a material to be joined 1 except its joint surface 2, then a low melting point alloy layer 4 is formed by a packing method on the surface 2. An etching preventive film 5 is formed on the surface of said layer 4 and is subjected to an etching treatment to remove the film 3. The film 5 is then removed by using a solvent so that the low melting point alloy layer for diffusion joining is formed only on the surface 2. The low melting point alloy layer is easily formed on the joint surface having an intricate shape by the above-mentioned method.
申请公布号 JPS59118292(A) 申请公布日期 1984.07.07
申请号 JP19820225892 申请日期 1982.12.24
申请人 HITACHI SEISAKUSHO KK 发明人 KATOU MITSUO;FUNAMOTO TAKAO;TAKAHASHI KAZUYA;OGURA SATOSHI;CHIKAZAKI MITSUO;FUKUI HIROSHI
分类号 B23K20/00;B23K1/00;B23K1/20;B23K20/16;B23K20/24 主分类号 B23K20/00
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