发明名称 LEAD FRAME AND MANUFACTURE OF THE SAME
摘要 PURPOSE:To improve bonding characteristic with Au lead, hardness and bending characteristic by specifying the size and distribution of deposited material containing Cr and Zr. CONSTITUTION:A lead frame is formed by Cu alloy which contains Cr of 0.1- 1wt% and Zr of 0.05-0.5wt% with deposition size of 0.5-50mum and distribution of 1,000-10,000pcs/mm.<2>. The Cu alloy also contains one or more kinds selected from Mg, Si, Sn, Ni, Fe, Zn, P in addition to Cr and Zr in total amount of 1wt% or less. Thereby, the bonding characteristic to Au lead, hardness and bending characteristic can be improved.
申请公布号 JPS59117144(A) 申请公布日期 1984.07.06
申请号 JP19820230402 申请日期 1982.12.23
申请人 TOSHIBA KK 发明人 SUGAI HIROZOU;YAMANE SHIGEMI;KUZE TAKASHI
分类号 C22C9/00;C22F1/08;H01L23/48;H01L23/495 主分类号 C22C9/00
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