| 摘要 |
Apparatus for automatically inserting parallel leads of electronic components into openings in a printed circuit board having an improved lead holding and guiding assembly. The improved lead holding and guiding assembly is associated with the frame of the apparatus and includes a guiding member mounted for rotation about an axis of rotation which extends in the x-direction, i.e., in the direction of a line which is orthogonal to both of the parallel leads, and for longitudinal movement in the z-direction, i.e., in the direction which is perpendicular to the orthogonal plane which contains the orthogonally extending line. The holding and guiding assembly further includes a pair of holding members disposed at respective sides of the guiding members such that the side surfaces of the end portion of the guiding member and the respective inner side surfaces of the holding members constitute lead holding and guiding portions. The holding members are mounted for rotation relative to the guiding member about respective axes of rotation so that the lead holding and guiding portions can be opened and closed as the holding members are rotated. |
