| 摘要 |
PURPOSE:To enable to execute automatic recovery of wafer processing function of a wafer processor without necessitating human arbitrary judgement by a method wherein respective means to perform the prescribed process, to clean a contaminated process chamber, to test the defect of the processed wafer, to judge necessity of cleaning according to the result of a test, and to command to make the processor to stop processing and to perform cleaning according to judgement about cleaning are provided. CONSTITUTION:A processor 21 received with a cleaning work command signal from a discriminator 24 inputs a temporary stop command signal to a CVD film generation sequencer 15 according to a program corresponding to the signal thereof, and inputs a work start command signal to a dry etching process sequencer 20. Accordingly, a high- frequency oscillator 4 applies a high-frequency voltage suitable for etching between the inside of a reaction chamber 2 and electrodes 3 according to a power controller 5, an exhaust valve 7 exhausts the reaction chamber 2 to low pressure suitable for etching according to a controller 9, and an etching gas flow valve 17 introduces etching gas such as Freon gas, etc., into the reaction chamber 2 according to a controller 19. As a result, etching is performed according to plasma reaction and accelerated ions, and a CVD film deposited and adhered inside of the reaction chamber 2 is removed as a cleaning contaminating matter being its target. |
