发明名称 DUMMY LEAD FRAME
摘要 PURPOSE:To obtain a lead frame for a test without being thrown away after one time use only, adhered resin can be removed simply, and enabled to be used repeatedly by a method wherein a dummy lead frame formed with no lead patterns is used. CONSTITUTION:Feeding referential holes 9 for positioning, resin penetrating openings 10 to make resin as to extend over both of upper and lower metal molds, and openings 11 for regulation of adhesion intensity of the upper and lower metal molds are provided to a lead frame 42, and the surface thereof is formed in the flat condition. Accordingly, after resin shot for a test is performed, adhered resin can be removed easily, and the lead frame thereof can be used repeatedly for the plural number of times without one time use only and then thrown away. The dummy lead frame thereof can be used repeatedly for 20 times usually, and the amount of the lead frames used can be reduced to 1/20 or less as compared with the usual case.
申请公布号 JPS59117222(A) 申请公布日期 1984.07.06
申请号 JP19820226280 申请日期 1982.12.24
申请人 HITACHI SEISAKUSHO KK;HITACHI YONEZAWA DENSHI KK 发明人 NAKAYAMA MOTOO;YAMAKI KATSUO;AZUMA MIKIO;FUNAYAMA MOMOHISA;TSUCHIDA KIYOSHI
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
代理机构 代理人
主权项
地址