发明名称 IC SOCKET
摘要 PURPOSE:To improve workability and reliability of soldering, wiring, and the like of an IC socket to a printed circuit board, by depositing a bonding material to an attaching surface of the printed circuit board. CONSTITUTION:Two stripes of bonding materials 3 are deposited on the back surface of a socket body 1. Said bonding material 3 comprises two stripes of insulating parts 4, which are bonded to the back surface of the socket body 1, and tapes 5, which are stuck to the surface of the bonding pastes 4 so that they can be separated. The bonding pastes 4 are exposed by separating the tapes 5, and stuck to the attaching surface of a printed circuit board. Thus an IC socket is fixed. In this way, the IC socket does not fall from a printed circuit board 6. Even though the printed circuit board 6 is turned over in order to perform soldering and wiring of socket terminals 2 to the printed circuit board 6, the IC socket is not required to be held by hands or a jig, and working can be continued under the intact state.
申请公布号 JPS59117278(A) 申请公布日期 1984.07.06
申请号 JP19820226313 申请日期 1982.12.24
申请人 HITACHI YONEZAWA DENSHI KK;HITACHI SEISAKUSHO KK 发明人 KOBAYASHI MASAYOSHI
分类号 H01L23/32;H05K3/30;H05K7/10 主分类号 H01L23/32
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