| 摘要 |
PURPOSE:To eliminate concentration of local stress and prevent the generation of cracks by forming a covering layer to the area where burrs or tab edgs are generated. CONSTITUTION:A semiconductor device is constituted by a semiconductor pellet 4, a tab lead 9, an external leadout wire 3, a resin sealing body 1 and a connector wire 5. A burr 6 protruded to the lower surface of tab 2 is covered with a plating layer 10. Crack of package resulting from protrusion of burr 6 can be prevented by providing a layer 10. It is also possible to provide a resin layer by coating a synthetic resin liquid in place of the plating layer 10. |
