摘要 |
PURPOSE:To facilitate trimming (adjustment of light amount), by providing a plurality of bonding pads on a stripe shaped resistor body corresponding to each light emitting part, selecting one of the bonding pads, and performing the bonding. CONSTITUTION:On a substrate 1, a stripe shaped resistor body 8 is formed in correspondence with each light emitting part 5, at the adjacent position of an array 3. A plurality of bonding pads 9a-9d are provided on each resistor body 8. The electric light receiving and emitting characteristcs of each ligh emitting part are measured by using a prober or by measuring photoluminescence. Based on the obtained data, the bonding pads 9a-9d of the resistor body corresponding to each light emitting part are selected so that the brightness of the light of the light emitting parts becomes equal when they are driven by the same voltage. The selected pads 9a-9d and a contact electrode 7 are connected by a bonding wire 10. |