发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a photosensitive resin composition for a printing plate with superior photosensitivity, printing resistance and sensitivity in printing by adding polyester resin having specified bicyclo or tricyclo rings and photosensitive unsatd. double bonds each adjacent to an aromatic ring in the molecular chain as a film forming component. CONSTITUTION:A compound having >=2 substituents selected from CH2OH, OH and COOR (R is H, alkyl or the like) on >=1 ring represented by formulae I - IIIis reacted with polyol and a compound represented by one of formulae IV- VII(where each of R1 and R1' is H, 1-4C alkyl, 1-4C alkoxy, halogen or NO2, R2 is 2-4C alkylene, each of (l) and (m) is 1-5, and (n) is 1-4) to obtain photosensitive polyester resin having >=1 kind of cyclic structures represented by the formulae I -III and photosensitive unsated. double bonds each adjacent to an aromatic ring represented by one of the formulae IV-VII in the molecular chain. A photosensitive layer is formed using a photosensitive resin composition contg. the photosensitive polyester resin to obtain a printing plate with superior photosensitivity, printing resistance and sensitivity in printing.
申请公布号 JPS59116650(A) 申请公布日期 1984.07.05
申请号 JP19820222968 申请日期 1982.12.21
申请人 DAINIPPON INK KAGAKU KOGYO KK 发明人 NAKAMURA CHIAKI;OE KOUJI;SASAKI TOSHIKI
分类号 C08F2/00;C08F2/48;C08G63/00;C08G63/52;C09D167/06;G03F7/032 主分类号 C08F2/00
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