PHOTOSENSITIVE POLYAMIDE RESIN COMPOSITION

摘要

A photosensitive polyamide resin composition is provided which comprises: (A) 100 wt. parts of an alcohol-soluble polyamide, (B) 0.1-50 wt. parts of a compound having both vinyl and epoxy groups in the same and one molecule, and (C) 10-200 wt. parts of a polyfunctional vinyl monomer having a molecular weight of lower than 2,000 and at least two linkages represented by the following formula: wherein R stands for H or CH3. This composition results in a photosensitive relief plate excellent in the image-reproducing property and softness and elasticity characteristics.