DRY-DEVELOPING PHOTOSENSITIVE DRY FILM RESIST, A SOLDER MASK MADE THEREOF, AND PROCESS FOR USING THE DRY FILM RESIST

摘要

A dry-developing dry film resist is provided comprising a photopolymerizable layer preferably sandwiched between a support sheet and a cover sheet, the layer comprising polymerizable monomer in excess of the absorptive capacity of the layer, photopolymerization initiator, and binder component of a plurality of polymers, at least one of these polymers being incompatible so as to be present as a dispersion in the layer to reduce the cohesive strength of the layer. The layer is developed by peeling away the support sheet, the unexposed area of the layer adhering to the support sheet and the exposed area adhering to the substrate to which it was laminated to form a resist image against such treatments as etching, plating and soldering, especially to make a printed circuit.