发明名称 PROCEDIMENTO PER IL MONTAGGIO DI COMPONENTI, QUALI M.O.S. E SIMILI, SU PANNELLI DI CIRCUITI STAMPATI MEDIANTE AGGRAFFATURA E PANNELLI E COMPONENTI PER L'ESECUZIONE DI TALE PROCEDIMENTO
摘要 <p>A lead or extension from the component has a tapered stem (13a) having two shoulders (14 and 15) adjacent its base portion facing the distal end of the tapered pin stems. The distal ends of the component pins (13) are pressed into the printed circuit board structure at the location of a conductive path so that the tapered end (13a) of each selected pin stem penetrates through the circuit board. After the stem (13a) is forced to penetrate through the thickness of the board, the free end (13b) of pin (13) is clinched. The contact with the conductive path (11, 12) is made not only at shoulders (14 and 15) where the contact quality is influenced by clinching the free end (13b) of pin (13) but also along the sides of the pin (at 16) with the silver and graphite pastes that the stem (13a) entrains by creeping along the hole during the forced penetration through the hole.</p>
申请公布号 IT8448499(D0) 申请公布日期 1984.07.04
申请号 IT19840048499 申请日期 1984.07.04
申请人 TEXAS INSTR SEMICONDUTTORI ITA 发明人 ROSARIO PINNAVAIA GIUSEPPE
分类号 H05K;H05K1/09;H05K1/11;H05K3/24;H05K3/30;H05K3/32;(IPC1-7):H05K/ 主分类号 H05K
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