| 摘要 |
PURPOSE:To improve the solderability, solder weather resistance and bondability of an electronic component part formed of an alloy containly mainly Cu by treating with hydrochloric acid in which density, moisture and treating time are specified, on the surface of the component part, thereby reducing quantities of added elements contained on the surface of the alloy. CONSTITUTION:When forming a lead-frame of Cu alloy which contains small amounts of Cr, Zr, Su, Fe, and/or Ni, hydrochloric acid of 0.5-36N is used after the formation to treat the surface at temperatures of 100 deg.C or lower for 1- 600sec. In this manner, metals of small amounts concentrated on the surface during the steps can be removed, polishing effects are raised, and this lead-frame can be adapted for an electronic component part. |
