| 摘要 |
PURPOSE:To position wafers at the prescribed position by a method wherein the first and the second rollers with which a pressing operation is performed are provided at the angle a little smaller than the prescribed angle for the center part of wafer positioning part, and the wafers are successively pressed by these two rollers. CONSTITUTION:A wafer is placed on the placing surface 21 of a wafer placing stand 20, and the first roller 32 and the second roller 40, which are used as a pressing member, are arranged on the external side face of the wafer making almost a right angle to the wafer placed surface. The wafer is pressed in y-direction by the roller 32 and pressed in x-direction by the roller 40. Also, on the side of the wafer facing to the roller 32, two rollers 44 and 45 which come in contact with the orientation provided on the wafer are provided, and then a roller 43 with which the position in x-direction will be prescribed is provided on the side which faces the roller 40. According to this constitution, the line l3 which links the rollers 40 and 43 does not pass above the wafer positioning center O3 and it is displaced a little from 90 deg. to the side of the roller 32. The positioning device is constituted as above, the rollers 32 and 34 are contacted to the side face of the wafer successively, and the wafer position is adjusted using the compressing force of the rollers. |
