| 摘要 |
PURPOSE:To facilitate the uniforming of thickness of a solder film, and thickening the solder film and the overall thickness, thereby to increase adhesive strength, and to improve conductivity and reliability by putting together an insulating substrate and a thin metallic plate or conductive film having the nearly same linear expansion coefficient as said substrate respectively through solder and sticking them to a metallic plate of an outer container. CONSTITUTION:An alumina substrate 1 carrying a part 3 and forming a conductive film 5 of silver-palladium group on its back surface and a metallic or conductive thin plate 6 having a linear expansion coefficient of 7X10<-6>/ deg.C (e.g. Kovar) are stuck together through Sn-Pb autectic solder 4-1, and said metallic or conductive thin plate 6 is stuck to a metallic plate 2 which is part of an outer container through eutectic solder 4-2. |
