| 摘要 |
PURPOSE:To obtain a plastic molded type semiconductor device easy to mold, enabled to perform successively manufacturing work, suitable for mass production, and moreover having high quality and reliability by a method wherein epoxy resin having rapid hardenability and thixotropy is used to be wound around a subassembly, and molding is performed to be hardened to form a sealing layer. CONSTITUTION:One-component type epoxy resin containing epoxy resin having the epoxy radical in the molecule and organic dihydric acid dihydrazide of 3-15mol and an imidasole compound of 2-7mol in relation to epoxy resin of 100mol is used as molding resin, for example. Epoxy resin is dropped at first to the place where a subassembly provided with a surface stabilizer 6 is rotating holding both electrodes 4 nearly horizontally. The epoxy resin receives frictional force at the parts coming in contact with the electrodes 4 and the surface stabilizer 6 according to the rotation to be degenerated thixotropically, and viscosity is reduced to wet favorably with the stabilizer 6. While frictional force of the resin at the part separated from the subassembly is reduced to generate hardly thixotropic degeneration, and the prescribed shape is held. Then only the surface of the epoxy resin is hardened by rotating the subassembly. The inside epoxy resin is hardened finally to obtain a plastic molded type diode having a sealing layer 11. |
