发明名称 DIFFUSION JOINING METHOD
摘要 PURPOSE:To suppress the formation of an intermetallic compd. and to improve the quality of a joined part by forming a dealloyed layer on the joint surfaces of members contg. alloy elements of high vapor pressure through a heating treatment in a high vacuum and subjecting the members to diffusion joining by using an insert material. CONSTITUTION:Cu alloy members are subjected to a heating treatment in a high vacuum to evaporate alloy elements having the higher vapor pressure than that of Cu, for example, Zn, Pb, Cd, P, etc. thereby forming a dealloyed layer approximate to pure Cu on the joint surfaces. The surfaces except the joint surfaces are beforehand coated with an evaporation preventive film. A required insert material is interposed between the dealloyed layers on the joint surfaces and is subjected to desired diffusion bonding to accelerate the diffusion of the insert metal to the base materials thereby suppressing the intermetallic compd. to be formed by the insert metal and the members to be joined and obtaining a homogeneously joined part. The improvement in the quality of the joined part is thus made possible and the working time is reduced. This method enables diffusion joining of various alloys and eliminates the formation of an intermetallic compd. in the joined part.
申请公布号 JPS59113989(A) 申请公布日期 1984.06.30
申请号 JP19820221823 申请日期 1982.12.20
申请人 HITACHI SEISAKUSHO KK 发明人 KATOU MITSUO;FUNAMOTO TAKAO
分类号 B23K20/00;B23K20/16 主分类号 B23K20/00
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